Piezoelectric type cooling device

ABSTRACT

There is provided a piezoelectric type cooling device including: a housing having an internal space formed by combining an upper housing and a lower housing and having openings allowing the internal space to be in communication with the atmosphere to allow air to be introduced thereinto and discharged therefrom; a diaphragm provided to traverse the internal space of the housing to divide the internal space into upper and lower blower chambers; and a piezoelectric actuator provided on at least one surface of the diaphragm to provide vertical driving force to the diaphragm.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims the priority of Korean Patent Application No.10-2011-0050315 filed on May 26, 2011, in the Korean IntellectualProperty Office, the disclosure of which is incorporated herein byreference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a piezoelectric type cooling deviceusing a piezoelectric actuator.

2. Description of the Related Art

When various electronic devices, including a computer, are continuouslyused, heat is generated therein and may deteriorate the performancethereof. Therefore, various electronic devices include at least onecooling unit.

According to the related art, a fan type cooling unit has mainly beenused. However, a cooling device using a fan has excessive noise,excessive power consumption, difficulties in a manufacturing methodthereof, and difficulties in miniaturization. Therefore, there is a needto provide a novel cooling device solving the defects according to therelated art.

SUMMARY OF THE INVENTION

An aspect of the present invention provides a cooling device capable ofhaving relatively low noise and low power consumption, being simplymanufactured, and being easily miniaturized.

According to an aspect of the present invention, there is provided apiezoelectric type cooling device including: a housing having aninternal space formed by combining an upper housing and a lower housingand having openings allowing the internal space to be in communicationwith the atmosphere to allow air to be introduced thereinto anddischarged therefrom; a diaphragm provided to traverse the internalspace of the housing to divide the internal space into upper and lowerblower chambers; and a piezoelectric actuator provided on at least onesurface of the diaphragm to provide vertical driving force to thediaphragm.

The upper and lower housings may be symmetrical with regard to oneanother.

The openings may be provided in the upper and lower housings,respectively.

The openings provided in the upper housing may be provided in a side ora main surface thereof.

The openings provided in the lower housing may be provided in a side ora main surface thereof.

Each of the upper and lower housing may include an air channel grooveformed in an inner peripheral surface thereof.

The air channel groove may be in communication with the opening at atleast one point.

Inner peripheral surfaces of the upper and lower housings may have adome shape corresponding to a shape in which the diaphragm movesvertically.

The diaphragm may be fitted between an upper edge and a lower edge atwhich the upper and lower housings are combined with each other.

The housing may have a cylindrical shape.

The housing may have a rectangular pillar shape.

A plurality of the piezoelectric actuators may be provided in a mannerin which they are overlapped on at least one surface of the diaphragm.

According to another aspect of the present invention, there is provideda piezoelectric type cooling device including: a housing having aninternal space formed by combining an upper housing and a lower housingand having openings allowing the internal space to be in communicationwith the atmosphere to allow air to be introduced thereinto anddischarged therefrom; a plurality of diaphragms each provided totraverse the internal space of the housing to divide the internal spaceinto a plurality of blower chambers having a vertically multilayeredshape; and a plurality of piezoelectric actuators each provided on atleast one surface of the plurality of diaphragms to provide verticaldriving force to the plurality of diaphragms.

The openings may be provided so that each of the blower chambers is incommunication with the atmosphere.

The openings provided in a blower chamber adjacent to a main surface ofthe upper or lower housing among the blower chambers may be provided ina side or the main surface of the upper or lower housing.

The openings provided in a blower chamber formed by the side of theupper or lower housing and the diaphragm, among the blower chambers, maybe provided in the side of the upper or lower housing.

The blower chamber formed by the side of the upper or lower housing andthe diaphragm, among the blower chambers, may further include apartition wall provided to traverse the internal space thereof.

The partition wall may be provided to have a through-hole formedtherein, such that the air may be vertically introduced or discharged.

According to another aspect of the present invention, there is provideda piezoelectric type cooling device including: a housing having aninternal space formed by combining an upper housing and a lower housingand having openings allowing the internal space to be in communicationwith the atmosphere to allow air to be introduced thereinto anddischarged therefrom; a lattice dividing partition wall dividing theinternal space of the housing in a lattice form to form a plurality ofindividual spaces; diaphragms each provided to traverse the individualspaces of the housing to divide each of the individual spaces into aplurality of blower chambers; and a plurality of piezoelectric actuatorseach provided on at least one surface of the diaphragms each provided inthe plurality of individual spaces to provide vertical driving force tothe diaphragms provided in each of the individual spaces.

The diaphragms may be connected as one.

A plurality of the diaphragms may be provided to traverse the individualspaces of the housing to divide each of the individual spaces into theplurality of blower chambers having a vertically multilayered shape.

According to another aspect of the present invention, there is provideda piezoelectric type cooling device formed by vertically multi-layeringa plurality of piezoelectric type cooling devices, the piezoelectrictype cooling device including: a housing having an internal space formedby combining an upper housing and a lower housing and having openingsallowing the internal space to be in communication with the atmosphereto allow air to be introduced thereinto and discharged therefrom; adiaphragm provided to traverse the internal space of the housing todivide the internal space into upper and lower blower chambers; and apiezoelectric actuator provided on at least one surface of the diaphragmto provide vertical driving force to the diaphragm.

According to another aspect of the present invention, there is provideda piezoelectric type cooling device formed by vertically multi-layeringa plurality of piezoelectric type cooling devices, the piezoelectrictype cooling device including: a housing having an internal space formedby combining an upper housing and a lower housing and having openingsallowing the internal space to be in communication with the atmosphereto allow air to be introduced thereinto and discharged therefrom; aplurality of diaphragms each provided to traverse the internal space ofthe housing to divide the internal space into a plurality of blowerchambers; and a plurality of piezoelectric actuators each provided on atleast one surface of the plurality of diaphragms to provide verticaldriving force to the plurality of diaphragms.

The upper housing may include a coupling protrusion protruded upwardlyfrom a main surface thereof, and the lower housing may include acoupling groove into which a coupling protrusion provided on an upperhousing of one piezoelectric type cooling device adjacent to a lowerportion of another piezoelectric type cooling device is insertedlyfixed, the coupling groove being provided in a main surface thereof soas to correspond to the coupling protrusion.

According to another aspect of the present invention, there is provideda piezoelectric type cooling device formed by adjacently coupling aplurality of piezoelectric type cooling devices to each other on thesame plane, the piezoelectric type cooling device including: a housinghaving an internal space formed by combining an upper housing and alower housing and having openings allowing the internal space to be incommunication with the atmosphere to allow air to be introducedthereinto and discharged therefrom; a diaphragm provided to traverse theinternal space of the housing to divide the internal space into upperand lower blower chambers; and a piezoelectric actuator provided on atleast one surface of the diaphragm to provide vertical driving force tothe diaphragm.

According to another aspect of the present invention, there is provideda piezoelectric type cooling device formed by adjacently coupling aplurality of piezoelectric type cooling devices to each other on thesame plane, the piezoelectric type cooling device including: a housinghaving an internal space formed by combining an upper housing and alower housing and having openings allowing the internal space to be incommunication with the atmosphere to allow air to be introducedthereinto and discharged therefrom; a diaphragm provided to traverse theinternal space of the housing to divide the internal space into upperand lower blower chambers; and a piezoelectric actuator provided on atleast one surface of the diaphragm to provide vertical driving force tothe diaphragm.

The housing may include a coupling protrusion protruded laterally fromone side thereof, and the lower housing may include a coupling grooveinto which a coupling protrusion provided on one side of a housing ofone piezoelectric type cooling device adjacent to the other side ofanother piezoelectric type cooling device is insertedly fixed, thecoupling groove being provided in the other side thereof so as tocorrespond to the coupling protrusion.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other aspects, features and other advantages of thepresent invention will be more clearly understood from the followingdetailed description taken in conjunction with the accompanyingdrawings, in which:

FIG. 1 is an assembled perspective view of a piezoelectric type coolingdevice according to an embodiment of the present invention;

FIG. 2 is an exploded perspective view of the piezoelectric type coolingdevice according to the embodiment of the present invention;

FIG. 3 is a cross-sectional view taken along line A-A of FIG. 1;

FIG. 4 is a cross-sectional view taken along line B-B of FIG. 1;

FIG. 5 is a plan view of an upper housing or a lower housing, which is acomponent according to the embodiment of the present invention, whenbeing viewed from an inner side thereof;

FIGS. 6A through 6C are cross-sectional views showing examples in whicha diaphragm, a component according to the embodiment of the presentinvention, is coupled;

FIGS. 7A through 7E are cross-sectionals view showing various examplesof openings provided according to the embodiment of the presentinvention;

FIGS. 8A through 8E are plan views showing various examples of theopening shown in FIGS. 7A through 7E;

FIGS. 9A and 9B are reference views showing an operation of thepiezoelectric type cooling device according to the embodiment of thepresent invention;

FIGS. 10A and 10B are cross-sectional views and internal perspectiveviews showing a shape in which a printed circuit board (PCB), a flexibleflat cable (FFC), and the like, supplying power to the piezoelectricactuator according to the embodiment of the present invention arecoupled;

FIGS. 11A and 11B are plan views showing a diaphragm including thepiezoelectric actuator used in FIGS. 10A and 10B; and

FIGS. 12A through 18B are views showing various examples in which aplurality of piezoelectric type cooling devices are provided accordingto another embodiment of the present invention.

DETAILED DESCRIPTION OF THE EMBODIMENTS

Embodiments of the present invention will now be described in detailwith reference to the accompanying drawings.

The embodiments of the present invention may be modified in manydifferent forms and the scope of the present invention should not belimited to the embodiments set forth herein. Rather, these embodimentsare provided so that this disclosure will be thorough and complete, andwill fully convey the concept of the invention to those skilled in theart. In the drawings, the shapes and dimensions may be exaggerated forclarity, and the same reference numerals will be used throughout todesignate the same or like components.

FIG. 1 is an assembled perspective view of a piezoelectric type coolingdevice according to an embodiment of the present invention; FIG. 2 is anexploded perspective view of the piezoelectric type cooling deviceaccording to the embodiment of the present invention; and FIG. 3 is across-sectional view taken along the line A-A of FIG. 1.

Referring to FIGS. 1 through 3, a piezoelectric type cooling device 1000according to the present embodiment may include: a housing 10 having aninternal space 11 formed by combining an upper housing 100 and a lowerhousing 200 and having openings 111 and 211 allowing the internal space11 to be in communication with the atmosphere to allow air to beintroduced thereinto and discharged therefrom; a diaphragm 20 providedto traverse the internal space 11 of the housing 10 to divide theinternal space 11 into upper and lower blower chambers 12 and 13; and apiezoelectric actuator 30 provided on at least one surface of thediaphragm 20 to provide vertical driving force to the diaphragm 20.

According to the present embodiment, since the piezoelectric actuator isin charge of driving of the cooling device, power consumption may berelatively low, noise may not be generated, and the cooling device has arelatively very simple structure, such that the cooling device may beminiaturized.

According to the embodiment of the present invention, the housing 12 mayhave a rectangular pillar shape as shown in FIGS. 1 and 2. In addition,although not shown, the housing 10 may have a cylindrical shape. Thehousing 10 is not limited to having the above-mentioned shape, but mayhave various shapes. In a case in which the housing 10 has therectangular pillar shape, since a unit combining the upper and lowerhousings 100 and 200 may be provided in a corner portion of the housing10, utilization of the space may be improved.

According to the embodiment of the present invention, the upper andlower housings 100 and 200 may be symmetrical with regard to oneanother. That is, the upper and lower housings 100 and 200 that have thesame shape may be combined while vertically facing each other. In thecase in which the upper and lower housings 100 and 200 have the sameshape, since the upper and lower housings 100 and 200 may besimultaneously produced in a single manufacturing line, productivity maybe improved and a manufacturing cost may be reduced. The upper and lowerhousings 100 and 200 may not also have the symmetrical shape accordingto formation positions of openings to be described below or a scheme ofcombining the upper and lower housings with each other, and may havevarious shapes according to an application of the cooling device.

According to the embodiment of the present invention, the internal space11 may be formed by combining the upper and lower housings 100 and 200.That is, in order to be utilized as a cooling device, the cooling deviceaccording to the embodiment of the present invention needs to have aspace into which air is introduced and from which air is discharged in astate in which the space is in communication with the atmosphere.According to the embodiment of the present invention, the internal space11 may serve to perform the above-mentioned role. When the upper andlower housings 100 and 200 are fixedly combined with each other, theinternal space 11 may be in communication with the atmosphere onlythrough the openings and all of other portions thereof may be maintainedin a sealed state.

The upper and lower housings 100 and 200 may respectively have mainsurfaces 110 and 210 and sides 130 and 230 defining a height of thehousing. The upper and lower housings 100 and 200 may form the internalspace 11 by combination therebetween, and the sides 130 and 230 maycorrespond to a height at which the internal space 11 is formed.

Inner peripheral surfaces of the upper and lower housings 100 and 200may have a dome shape corresponding to a shape in which a diaphragm 20to be described below moves vertically. In a case in which the innerperipheral surfaces of the upper and lower housings 100 and 200 have thedome shape, since a space between the diaphragm 20 and the upper orlower housing 100 or 200 is significantly reduced when the diaphragm 20compresses air, air staying in the internal space 11 may be applied withcompression power, such that the air may be efficiency discharged,whereby utilization of the space may be improved.

Each of the upper and lower housings 100 and 200 may include an airchannel groove 120 formed in the inner peripheral surface thereof. Thatis, when each of the air channel grooves 120 is formed in the innerperipheral surfaces of the upper and lower housings 100 and 200 formingthe internal space 11, a flow of the air may be induced, whereby the airmay be efficiency discharged from the cooling device. In addition, theair channel groove 120 may be in communication with an opening to bedescribed below at least one point, such that air flowing along the airchannel groove 120 is concentratedly discharged, whereby the air may berelatively more efficiently discharged.

The housing 10 according to the embodiment of the present invention mayinclude the opening 111 and 211 allowing the internal space 11 to be incommunication with the atmosphere to allow the air to be introducedthereinto and discharged therefrom. The openings 111 and 211 maycorrespond to an air passage allowing the internal space 11 to be incommunication with the atmosphere to allow the air to be introducedthereinto and discharged therefrom. The openings may have various shapesand be formed in various positions according to a provision position ofthe cooling device. That is, the openings may be formed in the mainsurface 110 or 210 and the side 130 or 230 of the upper or lower housing100 or 200, and be randomly or regularly formed in a case in which theopenings are formed in the main surface 110 or 210. In a case in whichthe openings are regularly formed, a plurality of openings may bedisposed concentrically to have a circular shape or be disposed to haveat least two concentric circles therefor. Further, the openings may beformed in the main surface 110 in the upper housing 100, and be formedin the side 230 in the lower housing 200, or vice versa.

According to the embodiment of the present invention, the diaphragm 20may be provided to traverse the internal space 11 of the housing 10 todivide the internal space 11 into upper and lower blower chambers 12 and13. According to the embodiment of the present invention, in order toutilize both of upward and downward movements of the diaphragm 20 in thecooling device to increase cooling device efficiency, the internal space11 may be divided into the upper and lower blower chambers 12 and 13,and both of the upper and lower blower chambers 12 and 13 may beutilized as spaces into and from which cooling air is introduced anddischarged. That is, both of the upper and lower blower chambers 12 and13 may be used as a cooling device by a mechanism in which in a case inwhich the diaphragm 20 moves upwardly, air in the upper blower chamber12 is discharged and air is introduced into the lower blower chamber 13and in a case in which the diaphragm 20 moves downwardly, air in thelower blower chamber 13 is discharged and air is introduced into theupper blower chamber 12. Through the above-mentioned scheme, thepiezoelectric type cooling device according to the embodiment of thepresent invention may have significantly high efficiency.

The diaphragm 20 may be a unimorph type diaphragm in which apiezoelectric element extended in a plane direction may be adhered toone surface of a resin plate or a metal plate, a bimorph type diaphragmin which piezoelectric elements extended in opposite directions may beadhered to both surfaces of a resin plate or a metal plate, and abimorph type diaphragm in which a multilayered piezoelectric elementbent and deformed in itself may be adhered to one surface of a resinplate or a metal plate. Furthermore, the entire diaphragm may be formedof a multilayered piezoelectric element. The diaphragm 20 may be anytype diaphragm as long as it may be bent and vibrate in a thicknessdirection of a plate by applying alternate voltage (sinusoidal voltageor rectangular wave voltage) to a piezoelectric element.

The diaphragm 20 may be fitted between an upper edge 131 and a loweredge 231 at which the upper and lower housings 100 and 200 are combinedwith each other. That is, the diaphragm 20 may be fitted betweenportions at which the side 130 of the upper housing 100 and the side 230of the lower housing 200 are combined with each other. As shown in FIG.2, as an example, the diaphragm 20 may have a rectangular shape andinclude through-holes 21 to be described below formed at corner portionsthereof so that fixing protrusions provided on the upper or lowerhousing 100 or 200 may penetrate therethrough. However, this casecorresponds to the case in which the diaphragm 20 has a rectangularshape. In a case in which the diaphragm 20 has a circular shape, sinceit is sufficient for the diaphragm 20 to traverse the internal space 11,the diaphragm 20 is not extended up to the corner portions of thehousings 100 and 200, such that separate through-holes are not required.

The diaphragm 20 may be fitted in various schemes, which will bedescribed below with reference to the accompanying drawings.

According to the embodiment of the present invention, the piezoelectricactuator 30 may be provided on at least one surface of the diaphragm 20to provide vertical driving force to the diaphragm 20. The piezoelectricactuator 30 may include a piezoelectric element and an electrode and usethe principle that a length of the piezoelectric element is changed atthe time of applying voltage.

According to the embodiment of the present invention, the piezoelectricactuator 30 may be mounted on one surface or both surfaces of thediaphragm 20. In addition, a plurality of piezoelectric actuators 30 maybe overlappedly mounted on one surface or both surface of the diaphragm20.

Further, the cooling device according to the embodiment of the presentinvention may include a printed circuit board (PCB) or a flexible flatcable (FFC) 50 connected to the electrode included in the piezoelectricactuator 20 so as to supply power to the piezoelectric actuator 30. Astructure related to this will be described below with reference to theaccompanying drawings.

Hereinafter, various embodiments of the present invention will bedescribed with reference to the accompanying drawings.

FIG. 4 is a cross-sectional view taken along line B-B of FIG. 1.Referring to FIG. 4, in a case in which the housing 10 has a rectangularpillar shape, each of corner portions of the pillar may be provided witha fixing groove or hole 112 provided in the upper housing 100 and afixing protrusion 212 provided on the lower housing 200 fixedly fittedinto the fixing groove or hole 112 as units capable of combining theupper and lower housings 100 and 200. Further, the fixing grooves orholes may be provided in the lower housing, and the fixing protrusionseach fixedly fitted into the fixing grooves or holes may be provided onthe upper housing, or some of the fixing protrusions may be provided onthe upper housing and the others thereof may be provided on the lowerhousing. Here, in a case in which the fixing hole is provided, thefixing hole may be formed to be stepped with regard to an inner portionthereof, such that the fixing protrusion may be fitted into the steppedportion.

Meanwhile, the upper and lower housings 100 and 200 may be symmetricalwith regard to one another. In this case, the upper and lower housings100 and 200 may have the same shape. In this case, each of the upper andlower housings 100 and 200 may be provided with the same fixing grooveor hole, and a separate fixing device may be fitted from the outsideinto the fixing groove or groove to fixedly combine the upper and lowerhousings with each other.

In addition, these fixing grooves or holes 112 and fixing protrusions212 may serve to accurately center the upper and lower housings 100 and200 in a case in which the upper and lower housings 100 and 200 arecombined with each other. That is, these fixing grooves or holes 112 andfixing protrusions 212 may also serve as a centering assembly.

FIG. 5 is a plan view of an upper housing or a lower housing, which is acomponent according to the embodiment of the present invention, whenbeing viewed from an inner side. Referring to FIG. 5, it may beappreciated that the upper or lower housing 100 or 200 may include theair channel groove 120 formed in the inner peripheral surface thereof,wherein the air channel groove 120 is in communication with the openings111 and 211.

FIGS. 6A through 6C are cross-sectional views showing examples in whicha diaphragm, a component according to the embodiment of the presentinvention, is coupled. Referring to FIGS. 6A through 6C, the diaphragm20 may be fitted between the upper and lower edges at which the upperand lower housings are combined with each other. Here, a distal endportion of the diaphragm 20 may be fitted into a portion between theedges (See FIG. 6A), be fitted into the entirety between the edges (SeeFIG. 6C), or be fitted into the fixing protrusions provided on the edges(See FIG. 6B). In addition to this, the diaphragm 20 may be fixed invarious shapes as long as it may be fixed while traversing the internalspace 11.

FIGS. 7A through 7E are cross-sectionals views showing various examplesof openings provided according to the embodiment of the presentinvention. Referring to FIGS. 7A through 7E, each of the openings 111and 211 may be provided in the main surfaces 110 and 210 or the sides130 and 230 of the upper and lower housings 100 and 200. That is, theopenings may be provided in one sides of the upper and lower housings100 and 200 to introduce and discharge air in one direction (See FIG.7A). Alternatively, the openings may be provided in different structuresin the upper and lower housings 100 and 200, such that the openings aredisposed concentrically to have a circular shape in an upper surface ofthe upper housing 100, and inner communication paths 213 that are incommunication with openings provided outwardly of the concentricallydisposed openings of the upper housing 200, among the openings providedtherein, are provided in the lower housing 200 to introduce air into anddischarge air from the upper housing 100 (See FIG. 7B). Alternatively,the openings may be provided in the main surfaces 110 and 210 of theupper and lower housings 100 and 200 to introduce and discharge air soas to be symmetrical to each other (See. FIGS. 7C and 7D). The number ofopenings may be appropriately adjusted as needed. Furthermore, theopenings may also be formed in the main surface 110 in the upper housing100, and be formed in the side 230 in the lower housing 200 (See FIG.7E).

The shape in which the openings are provided as described above is onlyan example. That is, the openings may be provided in various shapes atvarious positions according to an actual situation.

FIGS. 8A through 8E are plan views showing various examples of theopening shown in FIGS. 7A through 7E. In FIGS. 8A through 8E, in a casein which positions of the openings provided in the upper and lowerhousings are the same as each other, only one of the upper and lowerhousings is shown, and in a case in which positions of the openingsprovided in the upper and lower housings are different, each of theupper and lower housings is shown. In the piezoelectric type coolingdevice according to the embodiment of the present invention, theopenings 111 may be formed in various portions of the upper or lowerhousing 100 or 200 as described above.

For example, the openings may only be provided in one side 130 or 230 ofthe housing 100 or 200 (See FIG. 8A), or the inner communication paths213 that are in communication with the openings 111 provided in theupper housing 100 may be provided in the lower housing 200, such thatthe openings 111 may only be provided in the upper surface of the upperhousing 100 (See FIG. 8B). In addition, the openings may be disposed tohave a circular shape in the main surfaces 110 and 210 (See FIG. 8C), orbe disposed concentrically to have a circular shape therein (See FIG.8D). In addition, positions of the openings 111 each provided in theupper and lower housings 100 and 200 may be different. That is, theopenings 111 may be formed in the main surface 110 in the upper housing100 and be formed in the side 230 in the lower housing 200 (See FIG.8E).

FIGS. 9A and 9B are reference views showing an operation of thepiezoelectric type cooling device according to the embodiment of thepresent invention. According to the embodiment of the present invention,voltage may be applied to the piezoelectric actuator 30 provided on thediaphragm 20 to move the diaphragm 20 upwardly or downwardly, therebyoperating the cooling device.

Through FIG. 9A showing a shape in which the diaphragm 20 movesupwardly, it may be appreciated that the diaphragm 20 moves so as tocorrespond to a shape of the inner peripheral surface of the upperhousing 100 having a dome shape. In this case, air in the upper blowerchamber 12 may be discharged to the outside through the openings 111,and air may be introduced into the lower blower chamber 13 through theopenings 211.

To the contrary, through FIG. 9B showing a shape in which the diaphragm20 moves downwardly, it may be appreciated that the diaphragm 20 movesso as to correspond to a shape of the inner peripheral surface of thelower housing 200 having a dome shape. In this case, air may beintroduced into the upper blower chamber 12 through the openings 111,and air in the lower blower chamber 13 may be discharged into theoutside through the openings 211.

FIGS. 10A and 10B are cross-sectional views and internal perspectiveviews showing a shape in which a PCB, a FFC, and the like, supplyingpower to the piezoelectric actuator according to the embodiment of thepresent invention is coupled. FIGS. 11A and 11B are plan views showing adiaphragm including the piezoelectric actuator used in FIGS. 10A and10B.

According to the embodiment of the present invention, since thepiezoelectric actuator 30 provides power to the diaphragm 20 so as tomove the diaphragm 20, the piezoelectric actuator 30 needs to besupplied with electric power. Therefore, as a unit capable of supplyingthe electric power to the piezoelectric actuator 30, the PCB, FFC 50, orthe like, may be used, and a structure in which the PCB, FFC 50, or thelike, may be mounted may be provided.

As shown in FIGS. 10A and 11A, according to the embodiment of thepresent invention, the diaphragm 20 may be provided with a support 22protruded therefrom and extended toward one side. In this case, onesides of the housings 100 and 200 may be provided with a through-holethrough which the support 22 may be extended to the outside whilepenetrating therethrough. The PCB or FFC 50 may be fitted into thethrough-hole provided in one surfaces of the housings 100 and 200 whilebeing mounted on an upper surface of the support 22 and be thenelectrically connected to the piezoelectric actuator 30 provided on atleast one surface of the diaphragm 20, thereby supplying the electricpower to the piezoelectric actuator 30. Here, the diaphragm 20 may beprovided with a through-hole 21 capable of being coupled by the fixinggroove or hole 112 or the fixing protrusion 212, which are the centeringassemblies, such that the diaphragm 20 may be firmly fixed at the timeof combining the housings 100 and 200. The through-hole 21 may not alsobe provided.

As shown in FIGS. 10B and 11B, according to the embodiment of thepresent invention, the diaphragm 20 may be provided to have a circularshape and insertedly fixed into the internal space 11 of the housings100 and 200. In this case, one sides of the housings 100 and 200 may beprovided with a fitting groove into which the PCB or FFC 50 is fitted,and the PCB or the FFC 50 may be insertedly fixed into the fittinggroove and be then electrically connected to the piezoelectric actuator30 provided on at least one surface of the diaphragm 20, therebysupplying the electric power to the piezoelectric actuator 30.

FIGS. 12A through 18B are views showing various examples in which aplurality of piezoelectric type cooling devices are provided accordingto another embodiment of the present invention.

FIGS. 12A through 12C show a case in which a plurality of diaphragms 20traversing the internal space 11 are provided in a single housing 10. Asshown in FIGS. 12A through 12C, the piezoelectric type cooling deviceaccording to the present embodiment may include: the housing 10 havingan internal space 11 formed by combining an upper housing 100 and alower housing 200 and having openings 111 and 211 allowing the internalspace 11 to be in communication with the atmosphere to allow air to beintroduced thereinto and discharged therefrom; a plurality of diaphragms20 each provided to traverse the internal space 11 of the housing 10 todivide the internal space 11 into a plurality of blower chambers havinga vertically multilayered shape; and a plurality of piezoelectricactuators 30 each provided on at least one surface of the plurality ofdiaphragms 20 to provide vertical driving force to the plurality ofdiaphragms 20.

Here, the openings 111 and 211 may be provided so that each of theblower chambers is in communication with the atmosphere, openingsprovided in a blower chamber adjacent to a main surface 110 or 210 ofthe upper or lower housing 100 or 200 among the blower chambers may beprovided in a side 130 or 230 or the main surface 110 or 210 of theupper or lower housing 100 or 200. Further, openings provided in ablower chamber formed by the side 130 or 230 of the upper or lowerhousing 100 or 200 and the diaphragm 20 among the blower chambers may beprovided in the side 130 or 230 of the upper or lower housing 100 or200.

FIG. 13A shows that in the embodiment in which the plurality ofdiaphragms are provided in FIGS. 12A through 13C, a blower chamberformed by the side 130 or 230 of the upper or lower housing 100 or 200and the diaphragm 20 among the blower chambers may further include apartition wall 40 provided to traverse an internal space thereof, suchthat it may be utilized as a separate cooling space. In addition, thepartition wall 40 may be provided to have a through-hole 41 formedtherein, whereby a space may be flexibly utilized widely.

FIG. 14 shows a case in which a plurality of diaphragms 20 traversing aninternal space 11 are provided in a single housing 10. As shown in FIG.14, the piezoelectric type cooling device according to the presentembodiment may include: the housing 10 having an internal space 11formed by combining an upper housing 100 and a lower housing 200 andhaving openings 111 and 211 allowing the internal space 11 to be incommunication with the atmosphere to allow air to be introducedthereinto and discharged therefrom; a lattice dividing partition wall 45dividing the internal space 11 of the housing 10 horizontally in alattice form to form a plurality of individual spaces 11 a; diaphragms20 each provided to traverse the individual spaces 11 a of the housing10 to divide each of the individual spaces 11 a into a plurality ofblower chambers; and a plurality of piezoelectric actuators 30 eachprovided on at least one surface of the diaphragms 20 each provided inthe plurality of individual spaces 11 a to provide vertical drivingforce to the diaphragms 20 provided in each of the individual spaces 11a.

Here, the diaphragms 20 may be connected as one. That is, regardless ofeach individual space 11 a, a single large area diaphragm 20 may be usedin common. The diaphragms 20 may also be individually provided in eachindividual space 11 a.

In addition, a plurality of diaphragms 20 may be provided to traversethe individual spaces of the housing 10 to divide each of the individualspaces into the plurality of blower chambers having a verticallymultilayered shape.

FIG. 15 shows an example of a piezoelectric type cooling devicesuggested according to a scheme of FIG. 14. As shown in FIG. 15, thecooling device having various shapes and sizes according to a shape of ahousing may be provided.

FIGS. 16A and 16B show a piezoelectric type cooling device according toanother embodiment of the present invention formed by verticallymulti-layering the individually manufactured piezoelectric type coolingdevices.

As shown in FIGS. 16A and 16B, the piezoelectric type cooling device1000 formed by vertically multi-layering a plurality of piezoelectrictype cooling devices 1000 may include: a housing 10 having an internalspace 11 formed by combining an upper housing 100 and a lower housing200 and having openings 111 and 211 allowing the internal space 11 to bein communication with the atmosphere to allow air to be introducedthereinto and discharged therefrom; a diaphragm 20 provided to traversethe internal space 11 of the housing 10 to divide the internal space 11into upper and lower blower chambers; and a piezoelectric actuator 30provided on at least one surface of the diaphragm 20 to provide verticaldriving force to the diaphragm 20.

Here, the individual cooling devices 1000 may be vertically coupled toeach other using an adhesive (See FIG. 16A). Alternately, a couplingprotrusion 150 protruded upwardly from the main surface 110 of the upperhousing 100 of one piezoelectric type cooling device may be provided,and a coupling groove 250 into which a coupling protrusion 150 providedon an upper housing 100 of another piezoelectric type cooling deviceadjacent to a lower portion of one piezoelectric type cooling device isinsertedly fixed may be provided in the main surface 210 of the lowerhousing 200 so as to correspond to the coupling protrusion 150, suchthat the individual cooling devices 1000 may be vertically coupled toeach other in a fitting scheme of the protrusion (See FIG. 16B).

FIGS. 17A and 17B show a piezoelectric type cooling device according toanother embodiment of the present invention formed by verticallymulti-layering the individually manufactured piezoelectric type coolingdevices. According to the present embodiment, a plurality of diaphragms20 traversing each blower chamber provided in the individual coolingdevices 1000 may be provided.

That is, the piezoelectric type cooling device 1000 according to thepresent embodiment may include: a housing 10 having an internal space 11formed by combining an upper housing 100 and a lower housing 200 andhaving openings 111 and 211 allowing the internal space 11 to be incommunication with the atmosphere to allow air to be introducedthereinto and discharged therefrom; a plurality of diaphragms 20 eachprovided to traverse the internal space 11 of the housing 10 to dividethe internal space 11 into a plurality of blower chambers; and aplurality of piezoelectric actuators 30 each provided on at least onesurface of the plurality of diaphragms 20 to provide vertical drivingforce to the plurality of diaphragms 20.

Here, the individual cooling devices 1000 may be vertically coupled toeach other using an adhesive (See FIG. 17A). Alternately, a couplingprotrusion 150 protruded upwardly from the main surface 110 of the upperhousing 100 of one piezoelectric type cooling device may be provided,and a coupling groove 250 into which a coupling protrusion 150 providedon an upper housing 100 of another piezoelectric type cooling deviceadjacent to a lower portion of one piezoelectric type cooling device isinsertedly fixed may be provided in the main surface 210 of the lowerhousing 200 so as to correspond to the coupling protrusion 150, suchthat the individual cooling devices 1000 may be vertically coupled toeach other in a fitting scheme of the protrusion (See FIG. 17B).

FIGS. 18A and 18B show a piezoelectric type cooling device according toanother embodiment of the present invention formed by adjacentlycoupling a plurality of individually manufactured piezoelectric typecooling devices to each other on the same plane.

As shown in FIG. 18A, the piezoelectric type cooling device 1000 formedby adjacently coupling a plurality of piezoelectric type cooling devices1000 to each other on the same plane may include: a housing 10 having aninternal space 11 formed by combining an upper housing 100 and a lowerhousing 200 and having openings 111 and 211 allowing the internal space11 to be in communication with the atmosphere to allow air to beintroduced thereinto and discharged therefrom; a diaphragm 20 providedto traverse the internal space 11 of the housing 10 to divide theinternal space 11 into upper and lower blower chambers; and apiezoelectric actuator 30 provided on at least one surface of thediaphragm 20 to provide vertical driving force to the diaphragm 20.

In addition, according to the embodiment of FIG. 18B, a plurality ofdiaphragms 20 traversing each blower chamber provided in the individualcooling devices 1000 may be provided.

That is, the piezoelectric type cooling device 1000 according to thepresent embodiment may include: a housing 10 having an internal space 11formed by combining an upper housing 100 and a lower housing 200 andhaving openings 111 and 211 allowing the internal space 11 to be incommunication with the atmosphere to allow air to be introducedthereinto and discharged therefrom; a plurality of diaphragms 20 eachprovided to traverse the internal space 11 of the housing 10 to dividethe internal space 11 into a plurality of blower chambers; and aplurality of piezoelectric actuators 30 each provided on at least onesurface of the plurality of diaphragms 20 to provide vertical drivingforce to the plurality of diaphragms 20.

Here, a coupling protrusion 161 protruded laterally from one side of thehousing 10 of one piezoelectric type cooling device may be provided, anda coupling groove 163 into which a coupling protrusion 161 provided onone side of a housing of another piezoelectric type cooling deviceadjacent to the other side of one piezoelectric type cooling device isinsertedly fixed may be provided in the other side of the housing 10 soas to correspond to the coupling protrusion 161, such that theindividual cooling devices 1000 may be coupled to each other.

In addition, a reference numeral 51 that is not described may indicatean electric power cable supplying electric power to the piezoelectricactuator 30.

As set forth above, according to the embodiments of the presentinvention, the piezoelectric actuator may be used, whereby the coolingdevice may be operated at relatively low power, have a relatively simplestructure to thereby be miniaturized, and may be simply manufactured.

In addition, only when the diaphragm may move vertically by thepiezoelectric actuator, the cooling device may operate, whereby noisehardly occurs in the cooling device.

While the present invention has been shown and described in connectionwith the embodiments, it will be apparent to those skilled in the artthat modifications and variations can be made without departing from thespirit and scope of the invention as defined by the appended claims.

1. A piezoelectric type cooling device comprising: a housing having aninternal space formed by combining an upper housing and a lower housingand having openings allowing the internal space to be in communicationwith the atmosphere to allow air to be introduced thereinto anddischarged therefrom; a diaphragm provided to traverse the internalspace of the housing to divide the internal space into upper and lowerblower chambers; and a piezoelectric actuator provided on at least onesurface of the diaphragm to provide vertical driving force to thediaphragm.
 2. The piezoelectric type cooling device of claim 1, whereinthe upper and lower housings are symmetrical with regard to one another.3. The piezoelectric type cooling device of claim 1, wherein theopenings are provided in the upper and lower housings, respectively. 4.The piezoelectric type cooling device of claim 1, wherein the openingsprovided in the upper housing are provided in a side or a main surfacethereof.
 5. The piezoelectric type cooling device of claim 1, whereinthe openings provided in the lower housing are provided in a side or amain surface thereof.
 6. The piezoelectric type cooling device of claim1, wherein each of the upper and lower housing includes an air channelgroove formed in an inner peripheral surface thereof.
 7. Thepiezoelectric type cooling device of claim 6, wherein the air channelgroove is in communication with the opening at at least one point. 8.The piezoelectric type cooling device of claim 1, wherein innerperipheral surfaces of the upper and lower housings have a dome shapecorresponding to a shape in which the diaphragm moves vertically.
 9. Thepiezoelectric type cooling device of claim 1, wherein the diaphragm isfitted between an upper edge and a lower edge at which the upper andlower housings are combined with each other.
 10. The piezoelectric typecooling device of claim 1, wherein the housing has a cylindrical shape.11. The piezoelectric type cooling device of claim 1, wherein thehousing has a rectangular pillar shape.
 12. The piezoelectric typecooling device of claim 1, wherein a plurality of the piezoelectricactuators are provided in a manner in which they are overlapped on atleast one surface of the diaphragm.
 13. A piezoelectric type coolingdevice comprising: a housing having an internal space formed bycombining an upper housing and a lower housing and having openingsallowing the internal space to be in communication with the atmosphereto allow air to be introduced thereinto and discharged therefrom; aplurality of diaphragms each provided to traverse the internal space ofthe housing to divide the internal space into a plurality of blowerchambers having a vertically multilayered shape; and a plurality ofpiezoelectric actuators each provided on at least one surface of theplurality of diaphragms to provide vertical driving force to theplurality of diaphragms.
 14. The piezoelectric type cooling device ofclaim 13, wherein the openings are provided so that each of the blowerchambers is in communication with the atmosphere.
 15. The piezoelectrictype cooling device of claim 13, wherein the openings provided in ablower chamber adjacent to a main surface of the upper or lower housingamong the blower chambers are provided in a side or the main surface ofthe upper or lower housing.
 16. The piezoelectric type cooling device ofclaim 13, wherein the openings provided in a blower chamber formed bythe side of the upper or lower housing and the diaphragm, among theblower chambers, are provided in the side of the upper or lower housing.17. The piezoelectric type cooling device of claim 13, wherein theblower chamber formed by the side of the upper or lower housing and thediaphragm, among the blower chambers, further includes a partition wallprovided to traverse the internal space thereof.
 18. The piezoelectrictype cooling device of claim 17, wherein the partition wall is providedto have a through-hole formed therein, such that the air is verticallyintroduced or discharged.
 19. A piezoelectric type cooling devicecomprising: a housing having an internal space formed by combining anupper housing and a lower housing and having openings allowing theinternal space to be in communication with the atmosphere to allow airto be introduced thereinto and discharged therefrom; a lattice dividingpartition wall dividing the internal space of the housing in a latticeform to form a plurality of individual spaces; diaphragms each providedto traverse the individual spaces of the housing to divide each of theindividual spaces into a plurality of blower chambers; and a pluralityof piezoelectric actuators each provided on at least one surface of thediaphragms each provided in the plurality of individual spaces toprovide vertical driving force to the diaphragms provided in each of theindividual spaces.
 20. The piezoelectric type cooling device of claim19, wherein the diaphragms are connected as one.
 21. The piezoelectrictype cooling device of claim 19, wherein a plurality of the diaphragmsare provided to traverse the individual spaces of the housing to divideeach of the individual spaces into the plurality of blower chambershaving a vertically multilayered shape.
 22. A piezoelectric type coolingdevice formed by vertically multi-layering a plurality of piezoelectrictype cooling devices, the piezoelectric type cooling device comprising:a housing having an internal space formed by combining an upper housingand a lower housing and having openings allowing the internal space tobe in communication with the atmosphere to allow air to be introducedthereinto and discharged therefrom; a diaphragm provided to traverse theinternal space of the housing to divide the internal space into upperand lower blower chambers; and a piezoelectric actuator provided on atleast one surface of the diaphragm to provide vertical driving force tothe diaphragm.
 23. A piezoelectric type cooling device formed byvertically multi-layering a plurality of piezoelectric type coolingdevices, the piezoelectric type cooling device comprising: a housinghaving an internal space formed by combining an upper housing and alower housing and having openings allowing the internal space to be incommunication with the atmosphere to allow air to be introducedthereinto and discharged therefrom; a plurality of diaphragms eachprovided to traverse the internal space of the housing to divide theinternal space into a plurality of blower chambers; and a plurality ofpiezoelectric actuators each provided on at least one surface of theplurality of diaphragms to provide vertical driving force to theplurality of diaphragms.
 24. The piezoelectric type cooling device ofclaim 22, wherein the upper housing includes a coupling protrusionprotruded upwardly from a main surface thereof, and the lower housingincludes a coupling groove into which a coupling protrusion provided onan upper housing of one piezoelectric type cooling device adjacent to alower portion of another piezoelectric type cooling device is insertedlyfixed, the coupling groove being provided in a main surface thereof soas to correspond to the coupling protrusion.
 25. The piezoelectric typecooling device of claim 23, wherein the upper housing includes acoupling protrusion protruded upwardly from a main surface thereof, andthe lower housing includes a coupling groove into which a couplingprotrusion provided on an upper housing of one piezoelectric typecooling device adjacent to a lower portion of another piezoelectric typecooling device is insertedly fixed, the coupling groove being providedin a main surface thereof so as to correspond to the couplingprotrusion.
 26. A piezoelectric type cooling device formed by adjacentlycoupling a plurality of piezoelectric type cooling devices to each otheron the same plane, the piezoelectric type cooling device comprising: ahousing having an internal space formed by combining an upper housingand a lower housing and having openings allowing the internal space tobe in communication with the atmosphere to allow air to be introducedthereinto and discharged therefrom; a diaphragm provided to traverse theinternal space of the housing to divide the internal space into upperand lower blower chambers; and a piezoelectric actuator provided on atleast one surface of the diaphragm to provide vertical driving force tothe diaphragm.
 27. A piezoelectric type cooling device formed byadjacently coupling a plurality of piezoelectric type cooling devices toeach other on the same plane, the piezoelectric type cooling devicecomprising: a housing having an internal space formed by combining anupper housing and a lower housing and having openings allowing theinternal space to be in communication with the atmosphere to allow airto be introduced thereinto and discharged therefrom; a plurality ofdiaphragms each provided to traverse the internal space of the housingto divide the internal space into a plurality of blower chambers; and aplurality of piezoelectric actuators each provided on at least onesurface of the plurality of diaphragms to provide vertical driving forceto the plurality of diaphragms.
 28. The piezoelectric type coolingdevice of claim 26, wherein the housing includes a coupling protrusionprotruded laterally from one side thereof, and the lower housingincludes a coupling groove into which a coupling protrusion provided onone side of a housing of one piezoelectric type cooling device adjacentto the other side of another piezoelectric type cooling device isinsertedly fixed, the coupling groove being provided in the other sidethereof so as to correspond to the coupling protrusion.
 29. Thepiezoelectric type cooling device of claim 27, wherein the housingincludes a coupling protrusion protruded laterally from one sidethereof, and the lower housing includes a coupling groove into which acoupling protrusion provided on one side of a housing of onepiezoelectric type cooling device adjacent to the other side of anotherpiezoelectric type cooling device is insertedly fixed, the couplinggroove being provided in the other side thereof so as to correspond tothe coupling protrusion.